What is thermal shock? What is the thermal shock chamber?

What is thermal shock?

Thermal shock means that due to the rapid heating or cooling, the object generates a large amount of heat exchange in a short time. When the temperature changes drastically, the object will produce thermal shock. This phenomenon is called thermal shock.

When a metal material is subjected to rapid heating and cooling, a large temperature difference will be generated inside it, which will cause a large impact thermal stress. This phenomenon is called thermal shock.

A large thermal shock generates thermal stress that can exceed the yield limit of the material and cause damage to the metal parts.


What is the thermal shock chamber?

Thermal shock chamber is a kind of structural material or composite material that can be tolerated in a continuous environment of extremely high temperature and extremely low temperature in an instant, so that it can be caused by thermal expansion and contraction in the shortest time. Chemical changes and physical damage to the machine.


There are two main ways for DGBell’s thermal shock:

  1. Thermal Shock Test Chamber (Two Zone): the thermal shock chamber has two chambers (high temperature zone and low temperature zone), the high temperature zone and the low temperature zone are filled with silicone oil, and the sample is placed in a hanging basket, which passes through the high temperature zone and low temperature of the hanging basket.The movement of the zone achieves the effect of hot and cold shocks.
  2. Thermal Shock Test Chamber (Three Zone): The thermal shock chamber has three chambers (high temperature zone, normal temperature zone, and low temperature zone). During the test, the sample is kept in the normal temperature area, but the effect of cold and hot shock is achieved by the opening and closing of the damper in the high temperature area and the normal temperature area, and the damper in the low temperature area and the normal temperature area.

Leave a Reply

Your email address will not be published. Required fields are marked *